Nowadays, data centers have used an estimated 200 terawatt hours (TWh) each year, which is even more than the national energy consumption of some countries. At the same time, data centers contribute around 0.3% global carbon emissions. By 2030, the data centers are predicted to use around 7% of the global total electricity, and become the largest energy consumer in the Information and Communications Industry. For data centers, standard air conditioning can soak up 40% of the energy cost. The rapidly increasing energy demand of data center calls out a severe challenge for more advanced and efficient cooling technology.
Back to the 16th International Heat Transfer Conference, a “Multi-scale Innovative Cooling Technologies for Data centers” panel session has been successfully organized to discuss some important issues and new technologies on data center cooling, such as embedded microfluidic cooling, heat pipe, multiscale cooling systems, etc. Originated in which, a new series of conferences “International Forum on Data Center Cooling (IFDC)” will be held every two years, starting from 2020. This forum will focus on the new theory, practical technology and future development of data center cooling, including but not limited to: future development and innovative designing of data center, system architecture of big data center and edge computing center, optimization theory and method for systematic energy saving, integrated thermal-electrical designing and methodology, key cooling technology, enhanced heat transfer inside high-power electronic chips, etc. This forum aims to provide a platform for sharing the latest achievements and information in the field of data center cooling, and making connections between academics and professionals from all over the world.
This forum will be hosted by Tsinghua University. The sponsors include the Assembly for International Heat Transfer Conferences (AIHTC), International Center for Heat and Mass Transfer (ICHMT), Asian Union of Thermal Sciences and Engineering (AUTSE).
Forum Information
International Forum on Data Center
Cooling (IFDC)
Beijing International Convention Center, Beijing,
China, September 1-4, 2020
Organized
by
Institute of Engineering Thermophysics,
Department of Engineering Mechanics, Tsinghua University
Sponsors
Assembly for International Heat Transfer
Conferences (AIHTC)
International Center for Heat and Mass
Transfer (ICHMT)
Asian Union of Thermal Sciences and
Engineering (AUTSE)
